MediaTek Dimensity 7300 and 7300X Chipsets Will Bring Enhanced AI, Gaming, and Photography to Foldables and More

The MediaTek Dimensity 7300 and 7300X chipsets have just been announced with an emphasis on making smartphones even faster and more efficient. These new chipsets use advanced technology that makes them more power-efficient and boosts their overall performance. The Dimensity 7300X is specifically tailored for foldable phones, allowing it to support smartphones with two screens.

Both chipsets have a powerful eight-core processor with four high-speed and energy-saving cores. This combination ensures the phones run smoothly while using less power, improving efficiency by up to 25% compared to previous models.

The processors are paired with a new graphics unit that enhances gaming performance and energy efficiency by 20%, which is achieved through smart technology that optimizes how the phone uses resources and improves connections for both 5G and Wi-Fi.

The new MediaTek APU 655 significantly improves artificial intelligence (AI) capabilities, doubling the AI performance of previous models and making features like real-time photo and video enhancements more efficient and effective.

The MediaTek Dimensity 7300 series also offers advanced photography features, supporting up to a 200-megapixel main camera. It includes technology for better noise reduction, face detection, and high-dynamic-range (HDR) video, allowing users to capture high-quality images and videos in various lighting conditions.

It also enhances live-focus photo performance and speeds up photo remastering. Additionally, users can record 4K HDR video with a much wider dynamic range than other solutions.

MediaTek’s MiraVision 955 enhances display quality, supporting detailed and vibrant screens and improving media streaming and playback experiences.

The MediaTek Dimensity 7300X’s support for dual displays is particularly beneficial for foldable phones, helping manufacturers create innovative new designs.

Other notable features include improved power efficiency in 5G scenarios, faster 5G download speeds, reliable Wi-Fi connections, and dual 5G SIM card support. These features provide users with more flexibility and better connectivity options.

For more information on the Dimensity lineup, visit MediaTek’s website.

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About the Author

Judie Lipsett Stanford
Judie is the co-owner and Editor-in-Chief of Gear Diary, which she founded in September 2006. She started in 1999 writing software reviews at the now-defunct smaller.com; from mid-2000 through 2006, she wrote hardware reviews for and co-edited at The Gadgeteer. A recipient of the Sigma Kappa Colby Award for Technology, Judie is best known for her device-agnostic approach, deep-dive reviews, and enjoyment of exploring the latest tech, gadgets, and gear.

1 Comment on "MediaTek Dimensity 7300 and 7300X Chipsets Will Bring Enhanced AI, Gaming, and Photography to Foldables and More"

  1. rajee pandi | July 12, 2024 at 1:14 pm |

    Good to know

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